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$20.87

Original: $69.56

-70%
Laird A15336-01 A15336-01 Thermal Pad Tflex 300 Series 1.2 W/m.K Silicone Elastomer 4 mm 229—

$69.56

$20.87

The Story

The A15336-01 is a 4mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex� 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex� 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
  • Extreme compliancy allows material to totally blanket components
  • Low compression set enables the pad to be reused many times
  • UL94V-0 Flammability rating
  • -40 to 160°C Operating temperature
  • ±10% Thickness tolerance
  • 0.56% Out-gassing TML
  • 0.10% Out-gassing CVCM
  • 600ppm/c Coefficient thermal expansion (CTE)
Applications

Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive

Other details

Brand LAIRD
Part Number A15336-01
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.

Description

The A15336-01 is a 4mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex� 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex� 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
  • Extreme compliancy allows material to totally blanket components
  • Low compression set enables the pad to be reused many times
  • UL94V-0 Flammability rating
  • -40 to 160°C Operating temperature
  • ±10% Thickness tolerance
  • 0.56% Out-gassing TML
  • 0.10% Out-gassing CVCM
  • 600ppm/c Coefficient thermal expansion (CTE)
Applications

Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive

Other details

Brand LAIRD
Part Number A15336-01
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.

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