đźšš Free Worldwide Shipping on All Orders!Shop Now
ALLIANCE MEMORY AS4C64M16D3B-12BCN DRAM, DDR3, 1 Gbit, 64M x 16bit, 800 MHz, FBGA, 96 Pins
HomeStore

ALLIANCE MEMORY AS4C64M16D3B-12BCN DRAM, DDR3, 1 Gbit, 64M x 16bit, 800 MHz, FBGA, 96 Pins

ALLIANCE MEMORY AS4C64M16D3B-12BCN DRAM, DDR3, 1 Gbit, 64M x 16bit, 800 MHz, FBGA, 96 Pins

$4.80

Original: $16.00

-70%
ALLIANCE MEMORY AS4C64M16D3B-12BCN DRAM, DDR3, 1 Gbit, 64M x 16bit, 800 MHz, FBGA, 96 Pins—

$16.00

$4.80

The Story

Product Overview

AS4C64M16D3B-12BCN is a 64M x 16bit DDR3 synchronous DRAM (SDRAM). The 1Gb double-data-rate-3 DRAM is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. This synchronous device achieves high speed double-data-rate transfer rates of up to 1600Mb/sec/pin for general applications. The chip is designed to comply with all key DDR3 DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion.

  • JEDEC standard compliant, supports JEDEC clock jitter specification
  • Power supplies: VDD and VDDQ = +1.5V ± 0.075V
  • Fully synchronous operation, fast clock rate: 800MHz
  • Differential clock, CK and CK#, bidirectional differential data strobe, DQS and DQS#
  • 8 internal banks for concurrent operation, 8n-bit prefetch architecture
  • Pipelined internal architecture, programmable mode and extended mode registers
  • Additive latency (AL): 0, CL-1, CL-2, programmable burst lengths: 4, 8
  • Burst type: sequential/interleave, output driver impedance control, 8192 refresh cycles/64ms
  • Write levelling, ZQ calibration, dynamic ODT (Rtt-Nom and Rtt-WR), auto refresh and self refresh
  • 96-ball FBGA package, commercial temperature range from 0°C to 95°C

Product details

Technical Specifications

DRAM Type

DDR3

Memory Configuration

64M x 16bit

IC Case / Package

FBGA

Supply Voltage Nom

1.5V

Operating Temperature Min

0°C

Product Range

-

SVHC

No SVHC (27-Jun-2024)

Memory Density

1Gbit

Clock Frequency Max

800MHz

No. of Pins

96Pins

IC Mounting

Surface Mount

Operating Temperature Max

95°C

MSL

MSL 3 - 168 hours

Other details

Brand ALLIANCE MEMORY
Part Number AS4C64M16D3B-12BCN
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.

Description

Product Overview

AS4C64M16D3B-12BCN is a 64M x 16bit DDR3 synchronous DRAM (SDRAM). The 1Gb double-data-rate-3 DRAM is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. This synchronous device achieves high speed double-data-rate transfer rates of up to 1600Mb/sec/pin for general applications. The chip is designed to comply with all key DDR3 DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion.

  • JEDEC standard compliant, supports JEDEC clock jitter specification
  • Power supplies: VDD and VDDQ = +1.5V ± 0.075V
  • Fully synchronous operation, fast clock rate: 800MHz
  • Differential clock, CK and CK#, bidirectional differential data strobe, DQS and DQS#
  • 8 internal banks for concurrent operation, 8n-bit prefetch architecture
  • Pipelined internal architecture, programmable mode and extended mode registers
  • Additive latency (AL): 0, CL-1, CL-2, programmable burst lengths: 4, 8
  • Burst type: sequential/interleave, output driver impedance control, 8192 refresh cycles/64ms
  • Write levelling, ZQ calibration, dynamic ODT (Rtt-Nom and Rtt-WR), auto refresh and self refresh
  • 96-ball FBGA package, commercial temperature range from 0°C to 95°C

Product details

Technical Specifications

DRAM Type

DDR3

Memory Configuration

64M x 16bit

IC Case / Package

FBGA

Supply Voltage Nom

1.5V

Operating Temperature Min

0°C

Product Range

-

SVHC

No SVHC (27-Jun-2024)

Memory Density

1Gbit

Clock Frequency Max

800MHz

No. of Pins

96Pins

IC Mounting

Surface Mount

Operating Temperature Max

95°C

MSL

MSL 3 - 168 hours

Other details

Brand ALLIANCE MEMORY
Part Number AS4C64M16D3B-12BCN
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.